Copper Nugget

  1. Cathode
  2. Wire Rod
  3. ETP and DHP Cu Billet
  4. Single Wire
  5. Multi Wire
  6. Bunched Conductors
  7. Flat Wire
  8. Overhead Catenary System Wires
  9. Copper Tube and Busbar
  10. Copper Nuget

COPPER NUGGET

PHOSPHORUS BEARING COPPER ANODE (Cu-DXP)
OXYGEN FREE COPPER ANODE (Cu-OF)

 

Ideal Anode Material For Copper Electroplating Processes
All types of nuggets are produced in Outokumpu Upcast® process.Cu-OF nuggets have very high copper purity.
Phosphorus bearing copper anodes are alloyed by adding phosphorus into pure molten copper to have homogeneously dispersed alloy. Cu-DXP copper nuggets are ideal for printed circuit board (PCB) plating because of excellent deposition properties.Phosphorus content of Cu-DXP nuggets are between 0,04% and 0,06% which are ideal anodes for acidic plating baths.



 
 

TYPICAL ANALYSIS
  Phosphorus
(Cu-DXP)
Oxygen Free
(Cu-OF)
% Cu 99.940 min. 99.995 min.
% P 0.04 – 0.06 % < 2 ppm

 

DIMENSIONS
Diameter (mm) Length (mm)
(mm) (inch) (mm) (inch)
8 0.315 10-400 0.39 – 15.75
12,5 0.492 10-400 0.39 – 15.75
20 0.787 20-400 0.39 – 15.75
 
IMPURITIES
Bi, Mn < 1 ppm
Al, As, Ni, Si < 5 ppm
S < 10 ppm
Sb, Sn, Te < 5 ppm
Zn < 10 ppm
Ag < 15 ppm
Fe, Pb < 10 ppm

 

PACKING
Ø 44 lb (20 kg) in plastic bucket
Ø 1100 – 2200 lb (500 – 1000 kg) in wooden box
Ø 1100 – 2200 lb (500 – 1000 kg) in steel barrel
Ø 2200 lb (1000 kg) in big bag
*Please contact our Marketing Department for other nugget sizes and type of packing.